美卡诺新产品—BoPad系列

ASSEMBLY
If you wish, we can install further elements, such as PCBs, cable glands and complex electronics ESD-safe. We will also be pleased to perform final inspection of the entire application for you.

IMPROVEMENT
Our modern machinery allows various improvement
processes such as engraving and laser engraving,
printing and lacquering, powder and EMC coatings.

Additional services:
HMI
We create HMI devices for every  application.
From simple membrane mounting to the complex integration of touch screens. All in impressive quality and with an appealing design.
On request we fi t your touch screens or displays. These are joined to the glass front by means of optical bonding. In contrast to an air gap, the liquid glueing process achieves a high level of optical quality and mechanical stability.
PRINTING

We use screen and pad printing accordingto your instructions– the method of printing is coordinated with the product. We print in RAL, Pantone or HKS colours.

ELECTRONICS

The integration of highly-sensitive components /    modules and the fi nal check of the device by means of a function and end test is carried out by our qualifi ed and expert personnel.