飞思卡尔加入IBM半导体研发技术联盟

Freescale Joins IBM Technology Alliance for Semiconductor Research

飞思卡尔加入IBM半导体研发技术联盟

January 24, 2007 -- Freescale Semiconductor and IBM announced that Freescale will join the IBM technology alliance for joint semiconductor research and development. The agreement includes Complementary metal Oxide Semiconductor (CMOS) and Silicon-on-Insulator (SOI) technologies as well as advanced semiconductor research and design enablement transitioning at the 45-nanometer generation. Freescale is the first technology development partner in the IBM technology alliance to participate in both low-power and high-performance technology research and development.

2007年1月24日消息——飞思卡尔半导体公司和IBM宣布飞思卡尔将加入IBM半导体研发技术联盟。该协议包括互补金属氧化物半导体(CMOS)以及绝缘硅片(SOI)技术以及转向45纳米级别高端半导体的研究和设计。飞思卡尔是首家参与IBM技术联盟低功耗、高性能技术研发的技术开发合作伙伴。

This agreement brings together Freescale's leadership in key embedded markets, including automotive, networking, wireless, industrial and consumer, with IBM's success in developing world-class technology and industry-leading systems expertise.

这个协议将飞思卡尔在主要嵌入式市场，包括汽车、网络、无线、工业和消费市场的领导地位，与IBM在开发世界级技术的成功以及业界领先的系统专家技术结合了在一起。

This alliance will enable Freescale to further strengthen its manufacturing strategy. In addition to leveraging owned capacity in internal fabs and its existing relationships with leading foundry manufacturers, Freescale will have access to the combined manufacturing capacity of IBM's Common Platform partners. The Common Platform provides its semiconductor fabrication partners with synchronized manufacturing processes to help ensure the maximum flexibility and lowest development investment for multi-source, high volume manufacturing.

该联盟将使得飞思卡尔进一步加强其生产策略。除了调衡自有工厂的产能以及与现有领先的铸造厂商合作之外，飞思卡尔还将加入IBM倡导的“共同平台“合作伙伴的综合生产能力。该“共同平台”为其半导体制作合作伙伴提供同步的生产过程，帮助确保多源、高容量生产获得最大限度的机动性和最低的开发投资。

"This partnership creates an exciting opportunity to combine the complementary strengths of Freescale and the IBM Alliance," said Sumit Sadana, senior vice president, Strategy and Business Development and acting chief technology officer, Freescale. "This industry-leading technology roadmap will enable Freescale to deliver substantial value to our customers."

飞思卡尔代理首席技术官兼战略和业务发展部高级副总裁Sumit Sadana表示：“这次合作为飞思卡尔和IBM联盟的实力互补创造了一个极好机会。这一业界领先的技术路标将使飞思卡尔为客户带来巨大的价值。”

"Freescale's addition to the IBM technology alliance is a significant vote of confidence for IBM's collaborative model and the work we are doing jointly with our technology partners," said Lisa Su, vice president, Semiconductor Research and Development, IBM. "Freescale will be a valuable addition to our team, with its deep expertise in semiconductor process development and fast growing embedded applications, like automotive, networking and wireless."

IBM半导体研发部副总裁 Lisa Su则表示：“飞思卡尔加入IBM联盟是对IBM的合作模式以及我们联合技术合作伙伴正在开展的工作投的一张重要信任票。通过其在半导体过程开发的深厚技术能力，以及在汽车、网络和无线等飞速增长的嵌入式应用，飞思卡尔将成为我们团队很有价值的一个补充。”

about Freescale Semiconductor
关于飞思卡尔半导体

Freescale Semiconductor, Inc. is a global leader in the design and manufacture of embedded semiconductors for the automotive, consumer, industrial, networking and wireless markets. The privately held company is based in Austin, Texas, and has design, research and development, manufacturing or sales operations in more than 30 countries. Freescale is one of the world's largest semiconductor companies with sales of $6.2 billion (USD) for the most recently reported four quarters.

飞思卡尔半导体公司是一家为汽车、消费、工业、网络和无线市场设计和生产嵌入式半导体的全球领导者。私属的飞思卡尔总部位于德克萨斯州奥斯汀，在全球30多个国家拥有设计、研发、生产和销售业务。飞思卡尔是世界上最大的半导体公司之一，最近四个季度的报道销售额是62亿美元。

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